Carbon-Fiber Face-Sheet Hybridization and Phase-Change Filling for Multifunctional 3D Glass Spacer Composites: Mechanical, Thermomechanical, and EMI Shielding Assessment
Fibers and Polymers, vol.27, no.9, pp.4517-4533, 2026 (SCI-Expanded, Scopus)
- Publication Type: Article / Article
- Volume: 27 Issue: 9
- Publication Date: 2026
- Doi Number: 10.1007/s12221-026-01495-5
- Journal Name: Fibers and Polymers
- Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Compendex, INSPEC, Materials Science & Engineering Collection (ProQuest), Technology Collection (ProQuest)
- Page Numbers: pp.4517-4533
- Keywords: 3D spacer composite, EMI shielding, Fiber hybridization, Mechanical properties, Phase-change material, Thermal properties
- Çanakkale Onsekiz Mart University Affiliated: Yes
Abstract
Multifunctional enclosures for energy-dense systems increasingly require simultaneous load-bearing capacity, thermal regulation, and electromagnetic interference (EMI) shielding within lightweight structures. In this work, multifunctional 3D spacer composites were engineered by surface hybridization of E-glass 3D spacer fabrics with twill-woven carbon-fiber face sheets, followed by optional filling of the internal channels with a paraffin-based phase-change material (PCM). Carbon face-sheet hybridization increased the maximum bending force by 72% and flexural modulus from 6.6 to 9.7 GPa, while the peak impact force increased by 36% with reduced penetration and smaller damage zones. The hybrid laminate also exhibited a > 30% higher storage modulus and retained the stiffness up to ~ 61 °C. EMI shielding effectiveness of the hybrid composite was obtained as 66.2 dB. Despite carbon incorporation, the 3D architecture maintained low through-thickness thermal conductivity (0.040–0.045 W m⁻1 K⁻1), and PCM filling slightly reduced the conductivity while improving thermal-barrier behavior. The carbon fabric face-sheet hybridization combined with optional PCM integration provides a scalable route to lightweight 3D composites that concurrently deliver mechanical robustness, passive thermal management, and high-performance EMI shielding.