Effect of Moisture Content on Thermal Properties of Pumpkin Seed


KOCABIYIK H., Kayisoglu B., TEZER D.

INTERNATIONAL JOURNAL OF FOOD PROPERTIES, vol.12, no.2, pp.277-285, 2009 (Peer-Reviewed Journal) identifier identifier

  • Publication Type: Article / Article
  • Volume: 12 Issue: 2
  • Publication Date: 2009
  • Doi Number: 10.1080/10942910701673519
  • Journal Name: INTERNATIONAL JOURNAL OF FOOD PROPERTIES
  • Journal Indexes: Science Citation Index Expanded, Scopus
  • Page Numbers: pp.277-285

Abstract

The selected thermal properties, namely specific heat, thermal conductivity and thermal diffusivity were determined for pumpkin seeds in the moisture content range of 5.32-24.00% (d.b.). Specific heat was determined using the method of mixtures. Thermal conductivity was measured by the transient technique using the line heat source method assembled in a thermal conductivity probe. Specific heat, thermal conductivity, and thermal diffusivity of pumpkin seeds were found between 2.53 and 3.13 kJ kg-1K-1, 0.113, and 0.135 W m-1K-1, 9.954 10-8 and 1.289 10-7 m2 s-1, respectively, under the conditions with by changing moisture content. Specific heat and thermal conductivity of pumpkin seeds increased with increasing moisture content, while thermal diffusivity decreased with the increase in moisture content.