Modifying wetting properties of PI Film: The impact of surface texturing and CF4 and O2 plasma treatment

Aktas C., Bhethanabotla V., Ayyala R. S., ŞAHİNER N.

Applied Surface Science, vol.656, 2024 (SCI-Expanded) identifier

  • Publication Type: Article / Article
  • Volume: 656
  • Publication Date: 2024
  • Doi Number: 10.1016/j.apsusc.2024.159729
  • Journal Name: Applied Surface Science
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, PASCAL, Aerospace Database, Chemical Abstracts Core, Chimica, Communication Abstracts, Compendex, INSPEC, Metadex, Civil Engineering Abstracts
  • Keywords: Bacterial attachment, CF4 and O2 gas plasma, Contact angle, Surface free energy, Surface texturing
  • Çanakkale Onsekiz Mart University Affiliated: Yes


Polyimide (PI) is a versatile polymer widely used in various industries because of its excellent heat and chemical resistance, and structural properties. This study presents an effective method for modifying the surface properties of PI films using a combination of laser-induced surface texturing and low-pressure CF4 and O2 plasma treatments. Post plasma treatment and surface texturing, the polyimide (PI) films exhibited enhanced hydrophobicity, as indicated by an increased contact angle from 82.4 ± 0.8 degrees to 143.6 ± 2.2 degrees, and a reduced surface free energy from 45.0 ± 0.3 mN/m to 1.4 ± 0.3 mN/m. The friction force between water droplets and the treated PI films decreased by approximately 30 %, indicating a significant improvement in the wetting properties. Surface characterization with X-ray photoelectron spectroscopy (XPS) analysis confirmed the successful introduction of new fluorine-containing groups and an increase in the extent of C = O bonds. Importantly, the plasma gas treatment resulted in a significant decrease in bacterial attachment, demonstrating its potential for reducing biofouling.